Special Molded Forming [Pre-Molded Hollow Package]
Packaging with a special technique! Achieving high functionality!
● Pre-molded hollow package This is a package in which the cavity is pre-formed with molded resin, resulting in a hollow interior. It allows for packaging at a lower cost compared to cavity-type substrates such as ceramic substrates.
- 企業:エスタカヤ電子工業
- 価格:Other